(DE) Fraunhofer Institute for Reliability and Microintegration IZM

Welcome
17.08.2010
(DE) Fraunhofer Institute for Reliability and Microintegration IZM
IZM400px.jpg
Fraunhofer Institute for Reliability and Microintegration IZM
Gustav-Meyer-Allee 25
13355 Berlin
Germany

Phone: +49.30.4 64 03-1 30
Fax: +49.30.4 64 03-1 31
E-mail: ecodesignarc@izm.fraunhofer.de
Internet: http://www.izm.fraunhofer.de
Dept. Green Electronics: http://www.pb.izm.fhg.de/ee/index.html

Profile

The Fraunhofer Gesellschaft is the leading organization of applied research in Europe, undertaking contract research on behalf of industry, the service sector and the government. Commissioned by customers in industry, it provides rapid, economical and immediately applicable solutions to technical and organizational problems. The organization maintains more than 50 research establishments at locations throughout Germany.

Set up in Berlin in 1993, the Fraunhofer IZM soon became one of the leading experts on microelectronics and microsystems packaging worldwide. Main activities are research and development in the field of microelectronic packaging, including processes and technologies, materials, environmental engineering, test methods and reliability procedures for system integration. An extensive range of services facilitates the fast transfer of the latest results from research to industry.

BeCAP (Berlin Center of Advanced Packaging) is the cooperation of the Fraunhofer Institute for Reliability and Microintegration IZM and the Research Center for Microperipheric Technologies at the Technical University of Berlin. Whereas the Technical University is engaged in basic research the Fraunhofer IZM focuses on applied research and transfer of application oriented solutions to industrial partners.

Competencies: Technologies, Materials, and Reliability of Microelectronics Packaging

The main objective at the Fraunhofer IZM is to support companies in the broad application of microelectronic and microsystem technologies:
  • Technologies for system integration
  • Assembly and interconnection technologies
  • Material and substrate development, haracterization and simulation
  • Advanced system engineering and electrical testing
  • Application of thin silicon for flexible products and 3D integration, wafer level packaging
  • Polytronic systems, reel-to-reel manufacturing
  • Sensors, micro components, micro mechatronics and microsystems
  • Environmental engineering

Department Green Electronics

The main focus of our work is the early stage of product design and process engineering, where an integrated environmental approach results in most efficient solutions. We consider innovations from a holistic point of view and search for viable solutions, having the complete life cycle of products in mind: Life cycle-oriented eco-design of new electronic products and manufacturing processes is our core competence. Translating technological trends into sustainability terms needs quantitative as well as qualitative methods, such as the Design for Environment tools developed by Fraunhofer IZM. Together with industry partners electronic devices are analyzed from an environmental point of view to foster eco-efficiency. Improvement potentials, considering environmental as well as cost aspects, are identified in a joint effort. Design for Environment is also the task of the project MikroNetz. In co-operation with other partners a highly miniaturized and very energy efficient switched power supply device will be developed for mobile IT equipment.

The substitution of traditional substrates for PWB based on renewable resources was task of the project ARBOFORM. A lignin substrate was tested for usability as PWB. As a result it was concluded that the tested material can be used for PWB in a FR-2 category.

Green Electronics elaborates strategies for reuse of electronic assemblies and components. Current activities are research for methods to estimate the lifetime of product and assembly groups and their practical application. Our automated disassembly line provides technologies for inspection and quality control of desoldered components. We focus our attention on the environmental aspects of lead free interconnection systems.

Applied research and services in context to the EU-Directives WEEE and RoHS (Website in German) is still a base for our current project work. By creating international and national networks within EU projects like EFSOT, ELFNET or GREENROSE, we exemplify an efficient transfer of knowledge and technology regarding environmental friend and lead-free electronics in support of industry activities especially SME. With the creation of a new industry forum "directive-conform design for WEEE, RoHS and EuP" (Website in German) we intend to promote basic concepts and measures for eco-design in electronics on a long-term base.