French
ENSEIRB (08.04.2005)
Université Bordeaux 1, 1 Avenue du Dr. Albert Schweitzer
33402 TALENCE
France
Email: woirgard@ixl.fr, zardini@ixl.fr
IXL / ENSEIRB / University Bordeaux1
The IXL Laboratory belonging to ENSEIRB (Ecole Nationale Supérieure d'Electronique d'Informatique et Télécommunications de Bordeaux, http://www.ixl.fr or http://www.enseirb.fr) and linked to the University Bordeaux 1 and the CNRS comprises more than one hundred fourty research staff. IXL has developed a strong position in testing, assessment and failure analysis of electronic components and assemblies including SMT and hybrid power modules. Thermal measurement methods and simulations together with thermo-mechanical simulation strategies have been implemented specifically for these applications. Studies have also been conducted on the reliability of solder joints. Investigations on the influence of the microstructure of the solder alloys on the reliability of the solder joints have allowed establishing a degradation law and an early failure detector. A method allowing the evaluation of the creep of solder alloys by the measurement of the stresses in a silicon die has also been developed. IXL has participated to the European programs dedicated to automotive and railway applications and also dedicated to lead-free soldering. The local team working on the project has used the ANSYS finite element program to simulate the thermal and thermo-mechanical behaviour of electronic components and assemblies since 1985.
33402 TALENCE
France
Email: woirgard@ixl.fr, zardini@ixl.fr
IXL / ENSEIRB / University Bordeaux1
The IXL Laboratory belonging to ENSEIRB (Ecole Nationale Supérieure d'Electronique d'Informatique et Télécommunications de Bordeaux, http://www.ixl.fr or http://www.enseirb.fr) and linked to the University Bordeaux 1 and the CNRS comprises more than one hundred fourty research staff. IXL has developed a strong position in testing, assessment and failure analysis of electronic components and assemblies including SMT and hybrid power modules. Thermal measurement methods and simulations together with thermo-mechanical simulation strategies have been implemented specifically for these applications. Studies have also been conducted on the reliability of solder joints. Investigations on the influence of the microstructure of the solder alloys on the reliability of the solder joints have allowed establishing a degradation law and an early failure detector. A method allowing the evaluation of the creep of solder alloys by the measurement of the stresses in a silicon die has also been developed. IXL has participated to the European programs dedicated to automotive and railway applications and also dedicated to lead-free soldering. The local team working on the project has used the ANSYS finite element program to simulate the thermal and thermo-mechanical behaviour of electronic components and assemblies since 1985.
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Produire en respectant l'environnement permet de concevoir des produits performants et ainsi d'accentuer le succès financier de l'entreprise. Des retours d'expériences réussis dans ce domaine seront présentés au cours des séminaires. -
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Part 1: Business benefits through Eco-Design -
Part 1: Business benefits through Eco-Design - Beyond RoHS and WEEE
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